Showing 193–208 of 411 results

• KF Potassium Fluoride

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  Purity99.9 - 99.99 %

  Density (g/cm³)2.48

  Melting Point (°C)880

  Evaporation Temperature (°C)500

  ShapeGranules

• KNbO₃ Potassium Niobate

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  Dimensions10 mm × 10 mm × 0.5 mm
  max 40 mm × 30 mm

  Growth TechniqueTop Seeded Solution Growth

  Orientation(110)

  Dopingundoped

  Surface1 side / 2 sides polished

  StructureOrthorhombic
  Perovskite Type

  Lattice Constanta = 0.569 nm
  b = 0.397 nm
  c = 0.572 nm

  Melting Point1050 °C

  Density4.62 g/cm³

  Thermal Expansion Coefficient5.01 × 10^-6 K^-1 @ a- and c axis
  1.41 × 10^-6 K^-1 @ b axis

  Refractive Index2.41 @ a axis @ 430 nm
  2.49 @ b axis @ 430 nm
  2.27 @ c axis @ 430 nm

  Hardness5 M

• KTaO₃ Potassium Tantalate

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  Dimensions10 mm × 10 mm × 0.5 mm

  Growth TechniqueTop Seeded Flux Growth / Hydrothermal

  Orientation(100)
  (110)

  Dopingundoped

  Surface1 side / 2 sides polished

  StructureCubic

  Lattice Constanta = 0.398 nm

  Melting Point~ 1500 °C (noncongruently)

  Density7.03 g/cm³

  Thermal Expansion Coefficient4.027 × 10^-6 K^-1

  Refractive Index2.4145 @ 633 nm

  Hardness6 M

• C Carbon

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  Purity99.99 %

  Density (g/cm³)2.26

  Melting Point (°C)3550

• Cu Copper

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  Dimensions10 mm × 10 mm × 0.5 mm

  Growth TechniqueBridgman

  Orientation(100)
  (110)
  (111)

  Surface1 sides polished

  StructureCubic (FCC)

  Lattice Constanta = 0.361 nm

  Melting Point1083 °C

  Density8.96 g/cm³

  Thermal Expansion Coefficient16.5 × 10^-6 K^-1

  Thermal Conductivity401 W cm^-1 K^-1

  Hardness3 M

  Resistivity16.78 nΩ m @ 20 °C

• Cu Copper

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  Purity99.9 - 99.999 %

  Density (g/cm³)8.92

  Melting Point (°C)1085

• Cu Copper

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  Purity99.9 - 99.999 %

  Density (g/cm³)8.90

  Melting Point (°C)1083

  Evaporation Temperature (°C)1012

  ShapeGranules / Pellet / Wire / Sheet

• CuO Copper (II) Oxide

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  Purity99.9 - 99.99 %

  Density (g/cm³)6.30

  Melting Point (°C)1326

• CIGS Copper Indium Gallium Diselenide / CuIn_xGa_1-xSe₂

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  Purity99.99 - 99.999 %

• CuInO₂ Copper Indium Oxide

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  Purity99.9 - 99.99 %

• Cu % Copper base

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  Standard AlloyPurityComposition

  Cu - B99.99 - 99.999 %B % = 5 - 20 %

  Cu - Co99.99 - 99.999 %

  Cu - Cr99.99 - 99.999 %

  Cu - Ga99.99 - 99.999 %Ga % = 5 - 30 %

  Cu - In99.99 - 99.999 %

  Cu - In - Ga99.99 - 99.999 %

  Cu - Mn99.99 - 99.999 %

  Cu - Ni99.99 - 99.999 %

  Cu - Si99.99 - 99.999 %

  Cu - Sn99.99 - 99.999 %

  Cu - Sr99.99 - 99.999 %

  Cu - Ti99.99 - 99.999 %

  Cu - V99.99 - 99.999 %V % = 5 - 15 %

  Cu - Y99.99 - 99.999 %

  Cu - Zn99.99 - 99.999 %Zn % = 5 - 20 %

  Cu - Zr99.99 - 99.999 %

• CuO Copper Oxide

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  Purity99.9 - 99.999 %

  Density (g/cm³)6.30

  Melting Point (°C)1326

  ShapeGranules / Disks

• Cu₂S Copper Sulfide

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  Purity99.9 - 99.99 %

  Density (g/cm³)5.60

  Melting Point (°C)1100

• La Lanthanum

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  Purity99.9 - 99.99 %

  Density (g/cm³)6.15

  Melting Point (°C)920

• La Lanthanum

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  Purity99.9 - 99.99 %

  Density (g/cm³)6.17

  Melting Point (°C)920

  Evaporation Temperature (°C)1388

  ShapeGranules

• LaSrAlO₄ Lanthanum Strontium Aluminate

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  Dimensions10 mm × 10 mm × 0.5 mm

  Growth TechniqueCzochralski

  Orientation(100)

  Dopingundoped

  Surface1 side / 2 sides polished

  StructureTetragonal

  Lattice Constanta = 0.376 nm
  c = 1.263 nm

  Melting Point1650 °C

  Density5.92 g/cm³

  Thermal Expansion Coefficient10 × 10^-6 K^-1

  Dielectric Constant16.8

  Hardness6 - 6.5 M