• Cu Copper

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    Dimensions10 mm × 10 mm × 0.5 mm

    Growth TechniqueBridgman

    Orientation(100)
    (110)
    (111)

    Surface1 sides polished

    StructureCubic (FCC)

    Lattice Constanta = 0.361 nm

    Melting Point1083 °C

    Density8.96 g/cm3

    Thermal Expansion Coefficient16.5 × 10-6 K-1

    Thermal Conductivity401 W cm-1 K-1

    Hardness3 M

    Resistivity16.78 nΩ m @ 20 °C